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Syenta Announces Facility in Tempe, Bringing Its Advanced Semiconductor Packaging Technology to the U.S.
April 22, 2026

PHOENIX, Arizona, April 22 -- The Arizona Commerce Authority posted the following news from Syenta:

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Syenta Announces Facility In Tempe, Bringing Its Advanced Semiconductor Packaging Technology To The U.S.

TEMPE, AZ (April 21, 2026) -- Syenta, an Australian semiconductor technology company, today announced the opening of its first U.S. facility in Tempe, Arizona, bringing advanced packaging technology, high-skilled jobs, and global innovation to the st . . .

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