HKU Engineers Designed and Fabricated Inch-scale Ultrahard Diamond Wafers with 200 GPa Hardness
March 18, 2026
March 18, 2026
HONG KONG, March 18 -- The University of Hong Kong issued the following news release:
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HKU Engineers Designed and Fabricated Inch-scale Ultrahard Diamond Wafers with 200 GPa Hardness
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A research team co-led by Professor Yang Lu from the Department of Mechanical Engineering, Faculty of Engineering, The University of Hong Kong (HKU), and Professor Chengming Li from the Institute for Advanced Materials and Technology at University of Science . . .
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HKU Engineers Designed and Fabricated Inch-scale Ultrahard Diamond Wafers with 200 GPa Hardness
*
A research team co-led by Professor Yang Lu from the Department of Mechanical Engineering, Faculty of Engineering, The University of Hong Kong (HKU), and Professor Chengming Li from the Institute for Advanced Materials and Technology at University of Science . . .