Purdue deepens semiconductor, chips processing ties with Dassault Systemes in virtual twin initiative
January 16, 2026
January 16, 2026
WEST LAFAYETTE, Indiana, Jan. 16 -- Purdue University issued the following news release:
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Purdue deepens semiconductor, chips processing ties with Dassault Systemes in virtual twin initiative
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WEST LAFAYETTE, Ind. -Purdue University has signed a memorandum of understanding (MOU) with Dassault Systemes to establish a new lab to develop virtual twin technologies for semiconductor processing and testing at Purdue's Birck Nanotechnology . . .
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Purdue deepens semiconductor, chips processing ties with Dassault Systemes in virtual twin initiative
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WEST LAFAYETTE, Ind. -Purdue University has signed a memorandum of understanding (MOU) with Dassault Systemes to establish a new lab to develop virtual twin technologies for semiconductor processing and testing at Purdue's Birck Nanotechnology . . .
