Bourns Introduces Thermal Jumper Chip Series that Provides an Excellent Thermal Dissipation Solution in a Compact Form Factor
December 18, 2025
December 18, 2025
RIVERSIDE, California, Dec. 18 [Category: BizElectronic Products] -- Bourns, a manufacturer and supplier of electronic components, issued the following news release:
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Bourns Introduces Thermal Jumper Chip Series that Provides an Excellent Thermal Dissipation Solution in a Compact Form Factor
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RIVERSIDE, Calif., December 18, 2025 \- Bourns, Inc., a leading manufacturer and supplier of electronic components for power, protection, and sensin . . .
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Bourns Introduces Thermal Jumper Chip Series that Provides an Excellent Thermal Dissipation Solution in a Compact Form Factor
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RIVERSIDE, Calif., December 18, 2025 \- Bourns, Inc., a leading manufacturer and supplier of electronic components for power, protection, and sensin . . .
