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University of Texas-Austin: 3D Printed Chip Packages Could Supercharge Semiconductor Manufacturing
December 04, 2025
AUSTIN, Texas, Dec. 4 -- The University of Texas issued the following news release:

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3D Printed Chip Packages Could Supercharge Semiconductor Manufacturing

Engineers at The University of Texas at Austin are leading an academic and industry all-star team that aims to revolutionize the production of semiconductor chips with a new 3D printing method. The new approach, which the researchers are calling Holographic Metasurface Nano-Lithography (HMNL), aims . . .

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