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Binghamton University Researchers Seek to Bridge Gap Between Microchips and Electronics Packaging
November 01, 2025
BINGHAMTON, New York, Nov. 1 -- Binghamton University issued the following news:

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Binghamton University researchers seek to bridge gap between microchips and electronics packaging

South Korea's National Nano Fabrication Center awards $1.2 million to Integrated Electronics Engineering Center to develop '2.5D' technology

By Chris Kocher

A few months ago, New York state redesignated Binghamton University's Int . . .

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