Cadence Accelerates SoC, 3D-IC and Chiplet Design for AI Data Centers, Automotive and Connectivity in Collaboration With Samsung Foundry
June 17, 2025
June 17, 2025
SAN JOSE, California, June 17 -- Cadence Design Systems, a provider of electronic design automation and semiconductor intellectual property, issued the following news release on June 16, 2025:
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Cadence Accelerates SoC, 3D-IC and Chiplet Design for AI Data Centers, Automotive and Connectivity in Collaboration with Samsung Foundry
Expanded collaboration includes new multi-year IP agreement and joint development of advanced AI-driven flows on latest SF2P . . .
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Cadence Accelerates SoC, 3D-IC and Chiplet Design for AI Data Centers, Automotive and Connectivity in Collaboration with Samsung Foundry
Expanded collaboration includes new multi-year IP agreement and joint development of advanced AI-driven flows on latest SF2P . . .