Saturday - July 26, 2025
Ansys Thermal and Multiphysics Solutions Certified for Intel 18A Process and 3D-IC Designs
April 30, 2025
PITTSBURGH, Pennsylvania, April 30 -- Ansys, a computer-aided engineering software developer, issued the following news release:

* * *

Ansys Thermal and Multiphysics Solutions Certified for Intel 18A Process and 3D-IC Designs

Signoff certification includes power integrity, multi-die thermal reliability, and electromagnetic modeling for AI and HPC applications

Key Highlights

* Ansys RedHawk-SC and Ansys Totem power integrity signof . . .

Targeted News Service Document Request Form

This document is available to you by e-mail if you complete the form below with relevant information. There may be a fee for this article or ongoing service of similar materials. We will be in touch shortly.

Name:
What's your
Affiliation		 Government Newspaper / Media Business
Public Policy Individual / Student Educators
Email:
Phone:
Organization, if any:
State/Country you are in:
Additonal questions
or comments:

Click here for more information about our products

Click here for more information about our products