New chip tests cooling solutions for stacked microelectronics
April 28, 2025
April 28, 2025
CAMBRIDGE, Massachusetts, April 28 -- The Massachusetts Institute of Technology issued the following news:
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New chip tests cooling solutions for stacked microelectronics
As demand grows for more powerful and efficient microelectronics systems, industry is turning to 3D integration -- stacking chips on top of each other. This vertically layered architecture could allow high-performance processors, like those used for artificial intelligence, to be packa . . .
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New chip tests cooling solutions for stacked microelectronics
As demand grows for more powerful and efficient microelectronics systems, industry is turning to 3D integration -- stacking chips on top of each other. This vertically layered architecture could allow high-performance processors, like those used for artificial intelligence, to be packa . . .