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Cadence and TSMC Advance AI and 3D-IC Chip Design With Certified Design Solutions for TSMC's A16 and N2P Process Technologies
April 24, 2025
SAN JOSE, California, April 24 -- Cadence Design Systems, a provider of electronic design automation and semiconductor intellectual property, issued the following news release on April 23, 2025:

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Cadence and TSMC Advance AI and 3D-IC Chip Design with Certified Design Solutions for TSMC's A16 and N2P Process Technologies

Also announce tool certification for TSMC N3C process and initial collaboration on TSMC's newest A14 technology

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