SIA Welcomes Announcement of New CHIPS for America R&D Facility in Arizona for Semiconductor Prototyping and Advanced Packaging
January 07, 2025
January 07, 2025
WASHINGTON, Jan. 7 (TNSsta) -- The Semiconductor Industry Association issued the following statement on Jan. 6, 2025:
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The Semiconductor Industry Association (SIA) today released the following statement from SIA President and CEO John Neuffer commending the announcement of a new CHIPS for America research and development (R&D) facility in Arizona for semiconductor prototyping and advanced packaging. The facility's prototyping research will be operated by t . . .
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The Semiconductor Industry Association (SIA) today released the following statement from SIA President and CEO John Neuffer commending the announcement of a new CHIPS for America research and development (R&D) facility in Arizona for semiconductor prototyping and advanced packaging. The facility's prototyping research will be operated by t . . .