Electronic components can self-assemble using new technique
December 20, 2024
December 20, 2024
WASHINGTON, Dec. 20 (TNSres) -- The National Science Foundation issued the following news release:
A new technique for creating simple electronic device components proved effective in recent tests. The results show that self-assembly for more complicated electronics, like 3D computer chips, could be possible.
The findings are published in Materials Horizons and supported by the U.S. National Science Foundation Center for Complex Particle Systems. The technique exhibits . . .
A new technique for creating simple electronic device components proved effective in recent tests. The results show that self-assembly for more complicated electronics, like 3D computer chips, could be possible.
The findings are published in Materials Horizons and supported by the U.S. National Science Foundation Center for Complex Particle Systems. The technique exhibits . . .