Dow Recognizes the Winners for the 35th Dow Packaging Innovation Awards at Tokyo Pack 2024
October 25, 2024
October 25, 2024
MIDLAND, Michigan, Oct. 25 -- Dow, a materials science company that says it serves customers in high-growth markets such as packaging, infrastructure, mobility and consumer applications, issued the following news release:
Tokyo, Japan, October 24, 2024 - Dow (NYSE:DOW) announced today the winners of the 35th Packaging Innovation Awards (PIA). The winners were unveiled during an awards ceremony held in conjunction with Tokyo Pack 2024, where the winning entries will be showcased from . . .
Tokyo, Japan, October 24, 2024 - Dow (NYSE:DOW) announced today the winners of the 35th Packaging Innovation Awards (PIA). The winners were unveiled during an awards ceremony held in conjunction with Tokyo Pack 2024, where the winning entries will be showcased from . . .