University of Texas-Austin: New Thermal Interface Material Could Cool Down Energy-Hungry Data Centers
October 23, 2024
October 23, 2024
AUSTIN, Texas, Oct. 23 (TNSres) -- The University of Texas issued the following news release:
A new cooling technology could change how heat is managed in electronic devices -- from tiny semiconductors to massive data centers.
A team led by scientists and engineers at The University of Texas at Austin created a new "thermal interface material" that could organically remove heat from high-powered electronic devices, reducing or even eliminating the need for ext . . .
A new cooling technology could change how heat is managed in electronic devices -- from tiny semiconductors to massive data centers.
A team led by scientists and engineers at The University of Texas at Austin created a new "thermal interface material" that could organically remove heat from high-powered electronic devices, reducing or even eliminating the need for ext . . .