Biden-Harris Administration Announces Preliminary Terms with Infinera to Support Development of Semiconductor Technology Important for Communications and National Security
October 17, 2024
October 17, 2024
WASHINGTON, Oct. 17 -- The U.S. Department of Commerce issued the following news release:
Proposed CHIPS Funding Would Support Construction of Fab and Advanced Test and Packaging Facility and Create up to 1,700 Jobs in Pennsylvania and California
Today, the Biden-Harris Administration announced that the Department of Commerce and Infinera have signed a non-binding preliminary memorandum of terms (PMT) to provide up to $93 million in proposed direct funding under the CHI . . .
Proposed CHIPS Funding Would Support Construction of Fab and Advanced Test and Packaging Facility and Create up to 1,700 Jobs in Pennsylvania and California
Today, the Biden-Harris Administration announced that the Department of Commerce and Infinera have signed a non-binding preliminary memorandum of terms (PMT) to provide up to $93 million in proposed direct funding under the CHI . . .