New Advanced Packaging Facility Accelerates Future of Microelectronics Integration
July 10, 2024
July 10, 2024
CAMBRIDGE, Massachusetts, July 10 -- Draper issued the following news:
Draper is working toward the future of application-unique microelectronics product development with the creation of the Draper Advanced Packaging Facility to enable faster designing and building of microelectronic components.
The facility highlights Draper's established capabilities in three-dimensional heterogeneously integrated (3DHi) microsystems, which enables the stacking of separately manu . . .
Draper is working toward the future of application-unique microelectronics product development with the creation of the Draper Advanced Packaging Facility to enable faster designing and building of microelectronic components.
The facility highlights Draper's established capabilities in three-dimensional heterogeneously integrated (3DHi) microsystems, which enables the stacking of separately manu . . .