Purdue: New Institute Accelerates Future of Microelectronic System Integration, Advanced Packaging
October 20, 2023
October 20, 2023
WEST LAFAYETTE, Indiana, Oct. 20 (TNSres) -- Purdue University issued the following news release on Oct. 19, 2023:
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Purdue collaborates with Cadence, imec, SRC, Osaka University to bolster rapid technology development in U.S.
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Purdue University is working toward the future in microelectronic product development with the creation of the Institute for Advanced System Integration and Packaging (ASIP) to enable faster designing and buildi . . .
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Purdue collaborates with Cadence, imec, SRC, Osaka University to bolster rapid technology development in U.S.
* * *
Purdue University is working toward the future in microelectronic product development with the creation of the Institute for Advanced System Integration and Packaging (ASIP) to enable faster designing and buildi . . .