Sunday - December 22, 2024

Metal-Free Frame Design for Silicon Bridges for Semiconductor Packages

2024-12-17

ALEXANDRIA, Virginia, Dec. 17 -- INTEL CORPORATION, Santa Clara, California has been assigned a patent (No. US 12170253 B2, initially filed Feb. 24, 2023) developed by three inventors Dae-Woo Kim, Phoenix, Arizona; Sujit Sharan, Chandler, Arizona; and Sairam Agraharam, Chandler, Arizona, for "Metal-free frame design for silicon bridges for semiconductor packages." . . .

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Metal-Free Frame Design for Silicon Bridges for Semiconductor Packages

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