Saturday - December 21, 2024

Buffer Configurations for Communications Between Memory Dies and a Host Device

2024-12-17

ALEXANDRIA, Virginia, Dec. 17 -- MICRON TECHNOLOGY, INC., Boise, Idaho has been assigned a patent (No. US 12170127 B2, initially filed Dec. 22, 2022) developed by three inventors Sujeet V. Ayyapureddi, Boise, Idaho; Brent Keeth, Boise, Idaho; and Matthew A. Prather, Boise, Idaho, for "Buffer configurations for communications between memory dies and a host device." . . .

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Buffer Configurations for Communications Between Memory Dies and a Host Device

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