Saturday - December 21, 2024

Graphics Processing Unit and High Bandwidth Memory Integration Using Integrated Interface and Silicon Interposer

2024-12-17

ALEXANDRIA, Virginia, Dec. 17 -- MICRON TECHNOLOGY, INC., Boise, Idaho has been assigned a patent (No. US 12170275 B2, initially filed Aug. 4, 2022) developed by Chan H. Yoo, Boise, Idaho, and Owen R. Fay, Meridian, Idaho, for "Graphics processing unit and high bandwidth memory integration using integrated interface and silicon interposer." . . .

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Graphics Processing Unit and High Bandwidth Memory Integration Using Integrated Interface and Silicon Interposer

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