Sunday - December 22, 2024

Hardware Assembly

2024-12-17

ALEXANDRIA, Virginia, Dec. 17 -- THE HILLMAN GROUP, INC., Forest Park, Ohio has been assigned a patent (No. US 12168992 B2, initially filed Aug. 3, 2022) developed by Kwan Ming Edwin Kwok, Ontario, Canada, and Beesham Mahadeo, Toronto, Canada, for "Hardware assembly." . . .

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