Vertical Light Emitting Devices With Nickel Silicide Bonding and Methods of Manufacturing
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2024-12-17
ALEXANDRIA, Virginia, Dec. 17 -- MICRON TECHNOLOGY, INC., Boise, Idaho has been assigned a patent (No. US 12170348 B2, initially filed Dec. 27, 2021) developed by Michael J. Bernhardt, Boise, Idaho, for "Vertical light emitting devices with nickel silicide bonding and methods of manufacturing." . . .