Sunday - December 22, 2024

Semiconductor Device and Manufacturing Method Thereof

2024-12-17

ALEXANDRIA, Virginia, Dec. 17 -- TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD., Hsinchu, Taiwan has been assigned a patent (No. US 12170314 B2, initially filed Jan. 12, 2024) developed by four inventors Chun Hsiung Tsai, Xinpu Township, Taiwan; Chih-Hsin Ko, Fongshan, Taiwan; Clement Hsing Jen Wann, Carmel, New York; and Ya-Yun Cheng, Taichung, Taiwan, for "Semiconductor device and manufacturing method thereof." . . .

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Semiconductor Device and Manufacturing Method Thereof

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