Saturday - December 21, 2024

Microelectronic Devices Including Conductive Structures

2024-12-17

ALEXANDRIA, Virginia, Dec. 17 -- MICRON TECHNOLOGY, INC., Boise, Idaho has been assigned a patent (No. US 12171101 B2, initially filed Aug. 26, 2022) developed by eight inventors Daniel Billingsley, Meridian, Idaho; Matthew J. King, Boise, Idaho; Jordan D. Greenlee, Boise, Idaho; Yongjun J. Hu, Boise, Idaho; Tom George, Boise, Idaho; Amritesh Rai, Boise, Idaho; Sidhartha Gupta, Boise, Idaho; and Kyle A. Ritter, Boise, Idaho, for "Microelectronic devices including conductive structures." . . .

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Microelectronic Devices Including Conductive Structures

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