Sunday - December 22, 2024

Three-Dimensional Device With Vertical Core and Bundled Wiring

2024-12-17

ALEXANDRIA, Virginia, Dec. 17 -- TOKYO ELECTRON LIMITED, Tokyo, Japan has been assigned a patent (No. US 12170326 B2, initially filed Nov. 4, 2021) developed by Mark I. Gardner, Ceer Creek, Texas, and H. Jim Fulford, Marianna, Florida, for "Three-dimensional device with vertical core and bundled wiring." . . .

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Three-Dimensional Device With Vertical Core and Bundled Wiring

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