Sunday - December 22, 2024

High-Throughput Additively Manufactured Power Delivery Vias and Traces

2024-12-17

ALEXANDRIA, Virginia, Dec. 17 -- INTEL CORPORATION, Santa Clara, California has been assigned a patent (No. US 12170244 B2, initially filed June 26, 2020) developed by nine inventors Adel Elsherbini, Tempe, Arizona; Feras Eid, Chandler, Arizona; Georgios Dogiamis, Chandler, Arizona; Henning Braunisch, Phoenix, Arizona; Beomseok Choi, Chandler, Arizona; William J. Lambert, Tempe, Arizona; Stephen Morein, Chandler, Arizona; Ahmed Abou-Alfotouh, Chandler, Arizona; and Johanna Swan, Scottsdale, Ari . . .

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High-Throughput Additively Manufactured Power Delivery Vias and Traces

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