Sunday - December 22, 2024

Electronic Substrate Stacking

2024-12-17

ALEXANDRIA, Virginia, Dec. 17 -- INTERNATIONAL BUSINESS MACHINES CORPORATION, Armonk, New York has been assigned a patent (No. US 12170252 B2, initially filed Sept. 29, 2021) developed by four inventors Lei Shan, Carmel, New York; Daniel Joseph Friedman, Sleepy Hollow, New York; Griselda Bonilla, Hopewell Junction, New York; and John Knickerbocker, Monroe, New York, for "Electronic substrate stacking." . . .

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