Sunday - December 22, 2024

Molded Direct Contact Interconnect Structure Without Capture Pads and Method for the Same

2024-12-17

ALEXANDRIA, Virginia, Dec. 17 -- DECA TECHNOLOGIES USA, INC., Tempe, Arizona has been assigned a patent (No. US 12170261 B2, initially filed May 9, 2023) developed by five inventors Robin Davis, Vancouver, Washington; Timothy L Olson, Phoenix, Arizona; Craig Bishop, Scottsdale, Arizona; Clifford Sandstrom, Richfield, Minnesota; and Paul R. Hoffman, San Diego, California, for "Molded direct contact interconnect structure without capture pads and method for the same." . . .

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Molded Direct Contact Interconnect Structure Without Capture Pads and Method for the Same

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