Sunday - December 22, 2024

Integrated Circuit Assemblies With Direct Chip Attach to Circuit Boards

2024-12-17

ALEXANDRIA, Virginia, Dec. 17 -- INTEL CORPORATION, Santa Clara, California has been assigned a patent (No. US 12170273 B2, initially filed March 24, 2021) developed by six inventors Wilfred Gomes, Portland, Oregon; Sanka Ganesan, Chandler, Arizona; Abhishek A. Sharma, Hillsboro, Oregon; Doug B. Ingerly, Portland, Oregon; Mauro J. Kobrinsky, Portland, Oregon; and Kevin Fischer, Hillsboro, Oregon, for "Integrated circuit assemblies with direct chip attach to circuit boards." . . .

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Integrated Circuit Assemblies With Direct Chip Attach to Circuit Boards

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