Sunday - December 22, 2024

Semiconductor Package Using Cavity Substrate and Manufacturing Methods

2024-12-10

ALEXANDRIA, Virginia, Dec. 10 -- AMKOR TECHNOLOGY SINGAPORE HOLDING PTE. LTD., Singapore, Singapore has been assigned a patent (No. US 12165986 B2, initially filed Aug. 8, 2022) developed by five inventors Young Do Kweon, Boise, Idaho; JeongByung Chae, Incheon, South Korea; DongJoo Park, Incheon, South Korea; ByoungWoo Cho, Seoul, South Korea; and SeHwan Hong, Seoul, South Korea, for "Semiconductor package using cavity substrate and manufacturing methods." . . .

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Semiconductor Package Using Cavity Substrate and Manufacturing Methods

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