Sunday - December 22, 2024

Thermal Interface Material

2024-12-10

ALEXANDRIA, Virginia, Dec. 10 -- HENKEL AG & CO. KGAA, Duesseldorf, Germany has been assigned a patent (No. US 12163091 B2, initially filed March 9, 2021) developed by five inventors Yu Chen, Glastonbury, Connecticut; Lynnette M. Hurlburt, Manchester, Connecticut; Andrew D. Messana, Newington, Connecticut; Kevin J. Welch, Wallingford, Connecticut; and Robert Parkins Cross, Rocky Hill, Connecticut, for "Thermal interface material." . . .

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