Sunday - December 22, 2024

Electromagnetic Interference Shielding Enclosure With Thermal Conductivity

2024-12-10

ALEXANDRIA, Virginia, Dec. 10 -- INTEL CORPORATION, Santa Clara, California has been assigned a patent (No. US 12167530 B2, initially filed Dec. 18, 2020) developed by four inventors Jaejin Lee, Hillsboro, Oregon; James Panakkal, KA, India; Min Suet Lim, Penang, Malaysia; and Aiswarya M. Pious, Karnataka, India, for "Electromagnetic interference shielding enclosure with thermal conductivity." . . .

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Electromagnetic Interference Shielding Enclosure With Thermal Conductivity

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