Sunday - December 22, 2024

Injection Molded Solder Head With Improved Sealing Performance

2024-12-10

ALEXANDRIA, Virginia, Dec. 10 -- INTERNATIONAL BUSINESS MACHINES CORPORATION, Armonk, New York has been assigned a patent (No. US 12166008 B2, initially filed Nov. 18, 2021) developed by four inventors Sayuri Hada, Machida, Japan; Toyohiro Aoki, Yokohama, Japan; Takashi Hisada, Hachiouji, Japan; and Shintaro Yamamichi, Kunitachi, Japan, for "Injection molded solder head with improved sealing performance." . . .

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Injection Molded Solder Head With Improved Sealing Performance

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