Sunday - December 22, 2024

Apparatuses for Executing a Direct Transfer of a Semiconductor Device Die Disposed on a First Substrate to a Second Substrate

2024-12-10

ALEXANDRIA, Virginia, Dec. 10 -- COWLES SEMI, LLC, Spokane, Washington has been assigned a patent (No. US 12165895 B2, initially filed Aug. 14, 2023) developed by four inventors Andrew Huska, Liberty Lake, Washington; Justin Wendt, Post Falls, Idaho; Luke Dupin, Liberty Lake, Washington; and Cody Peterson, Hayden Lake, Idaho, for "Apparatuses for executing a direct transfer of a semiconductor device die disposed on a first substrate to a second substrate." . . .

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Apparatuses for Executing a Direct Transfer of a Semiconductor Device Die Disposed on a First Substrate to a Second Substrate

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