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Integrated Assemblies Having Thicker Semiconductor Material Along One Region of a Conductive Structure Than Along Another Region, and Methods of Forming Integrated Assemblies

2024-12-10

ALEXANDRIA, Virginia, Dec. 10 -- An inventor from Boise, Idaho, Kunal R. Parekh has been awarded a patent (No. US 12167602 B2, initially filed May 11, 2023) for "Integrated assemblies having thicker semiconductor material along one region of a conductive structure than along another region, and methods of forming integrated assemblies." . . .

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Integrated Assemblies Having Thicker Semiconductor Material Along One Region of a Conductive Structure Than Along Another Region, and Methods of Forming Integrated Assemblies

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