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Isolation Layers in Stacked Semiconductor Devices

2024-12-10

ALEXANDRIA, Virginia, Dec. 10 -- TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD., Hsinchu, Taiwan has been assigned a patent (No. US 12166037 B2, initially filed Aug. 27, 2021) developed by Wei-Lun Chen, Taipei, Taiwan, and Pinyen Lin, Rochester, New York, for "Isolation layers in stacked semiconductor devices." . . .

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Isolation Layers in Stacked Semiconductor Devices

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