Enabling Hierarchical Data Loading in a Resistive Processing Unit (RPU) Array for Reduced Communication Cost
Copyright © Targeted News Service 2024
2024-12-10
ALEXANDRIA, Virginia, Dec. 10 -- INTERNATIONAL BUSINESS MACHINES CORPORATION, Armonk, New York has been assigned a patent (No. US 12165046 B2, initially filed March 16, 2021) developed by four inventors Seyoung Kim, Pohang, South Korea; Eun Kyung Lee, Bedford Corners, New York; Mingu Kang, Old Tappan, New Jersey; and Seonghoon Woo, New York, New York, for "Enabling hierarchical data loading in a resistive processing unit (RPU) array for reduced communication cost." . . .