Sunday - December 22, 2024

Integrated Assemblies and Methods of Forming Integrated Assemblies

2024-12-10

ALEXANDRIA, Virginia, Dec. 10 -- MICRON TECHNOLOGY, INC., Boise, Idaho has been assigned a patent (No. US 12167604 B2, initially filed Oct. 19, 2023) developed by seven inventors Shuangqiang Luo, Boise, Idaho; Dong Wang, Singapore, Singapore; Rui Zhang, Boise, Idaho; Da Xing, Singapore, Singapore; Xiao Li, Boise, Idaho; Pei Qiong Cheung, Singapore, Singapore; and Xiao Zeng, Singapore, Singapore, for "Integrated assemblies and methods of forming integrated assemblies." . . .

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