Sunday - December 22, 2024

Microbump Cluster Probing Architecture for 2.5D and 3D Dies

2024-12-10

ALEXANDRIA, Virginia, Dec. 10 -- INTEL CORPORATION, Santa Clara, California has been assigned a patent (No. US 12163982 B2, initially filed March 31, 2022) developed by three inventors Jagat Shakya, Hillsboro, Oregon; Ethan Caughey, Hillsboro, Oregon; and Joseph Parks, Jr., Portland, Oregon, for "Microbump cluster probing architecture for 2.5D and 3D dies." . . .

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Microbump Cluster Probing Architecture for 2.5D and 3D Dies

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