Composition and Method for Polysilicon CMP
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2024-12-03
ALEXANDRIA, Virginia, Dec. 3 -- CMC MATERIALS LLC, Aurora, Illinois has been assigned a patent (No. US 12157834 B2, initially filed Sept. 2, 2020) developed by Sarah Brosnan, St. Charles, Illinois, and Brian Reiss, Woodridge, Illinois, for "Composition and method for polysilicon CMP." . . .