Sunday - December 22, 2024

Wire Bond Damage Detector Including a Detection Bond Pad Over a First and a Second Connected Structures

2024-12-03

ALEXANDRIA, Virginia, Dec. 3 -- TEXAS INSTRUMENTS INC., Dallas, Texas has been assigned a patent (No. US 12159808 B2, initially filed Dec. 5, 2022) developed by Hung-Yun Lin, Murphy, Texas, and Siva Prakash Gurrum, Allen, Texas, for "Wire bond damage detector including a detection bond pad over a first and a second connected structures." . . .

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Wire Bond Damage Detector Including a Detection Bond Pad Over a First and a Second Connected Structures

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