Glove With Reduced Circumference Fingertip Regions
Copyright © Targeted News Service 2024
2024-12-03
ALEXANDRIA, Virginia, Dec. 3 -- SUMMIT GLOVE INC., Minerva, Ohio has been assigned a patent (No. US 12156555 B2, initially filed March 28, 2023) developed by James L Hull, Malvern, Ohio, and Wong Fook Lin, Kuala Lumpur, Malaysia, for "Glove with reduced circumference fingertip regions." . . .