Sunday - December 22, 2024

Embedded Bridge Die With Through-Silicon Vias

2024-12-03

ALEXANDRIA, Virginia, Dec. 3 -- INTEL CORPORATION, Santa Clara, California has been assigned a patent (No. US 12159813 B2, initially filed Feb. 17, 2023) developed by four inventors Aditya S. Vaidya, Gilbert, Arizona; Ravindranath V. Mahajan, Chandler, Arizona; Digvijay A. Raorane, Chandler, Arizona; and Paul R. Start, Chandler, Arizona, for "Embedded bridge die with through-silicon vias." . . .

Information Request Form

Name:
Category that best fits the type of business or agency you are affiliated with:	Government Newspaper / Media Business Public Policy Individual / Student Educators
Company Name:
Email:
Phone:
State:

I'd like to have a copy of this article mailed to me.

To also receive a free sample of other Targeted News products check the appropriate boxes below.
Golf Handicap site (FairwayFiles.com)
Products marked with ** can be customized by keywords or areas of interest. If you select them please specify your keywords in the box below:

If we need to contact you please specify your preferred contact method. Have a representative contact me by phone
Have a representative contact me via email

Additonal questions or comments:

Click here for more information or a free trial

Existing Customer Login

Embedded Bridge Die With Through-Silicon Vias

Information Request Form

Copyright Targeted News Service 2024