Sunday - December 22, 2024

Full Dynamic Post-Package Repair

2024-12-03

ALEXANDRIA, Virginia, Dec. 3 -- ADVANCED MICRO DEVICES, INC., Santa Clara, California has been assigned a patent (No. US 12158827 B2, initially filed Dec. 29, 2022) developed by three inventors Kedarnath Balakrishnan, Bangalore, India; Kevin M. Brandl, Austin, Texas; and James R. Magro, Lakeway, Texas, for "Full dynamic post-package repair." . . .

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