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Designs and Manufacturing Methods for Lightweight Hyperdamping Materials Providing Large Attenuation of Broadband-Frequency Structure-Borne Sound

2024-12-03

ALEXANDRIA, Virginia, Dec. 3 -- OHIO STATE INNOVATION FOUNDATION, Columbus, Ohio has been assigned a patent (No. US 12158190 B2, initially filed Dec. 23, 2022) developed by Ryan L. Harne, Columbus, Ohio, for "Designs and manufacturing methods for lightweight hyperdamping materials providing large attenuation of broadband-frequency structure-borne sound." . . .

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Designs and Manufacturing Methods for Lightweight Hyperdamping Materials Providing Large Attenuation of Broadband-Frequency Structure-Borne Sound

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