Sunday - December 22, 2024

Semiconductor Package With Front Side and Back Side Redistribution Structures and Fabricating Method Thereof

2024-12-03

ALEXANDRIA, Virginia, Dec. 3 -- AMKOR TECHNOLOGY SINGAPORE HOLDING PTE. LTD., Singapore, Singapore has been assigned a patent (No. US 12159823 B2, initially filed May 12, 2023) developed by four inventors Michael Kelly, Queen Creek, Arizona; David Hiner, Chandler, Arizona; Ronald Huemoeller, Gilbert, Arizona; and Roger St. Amand, Tempe, Arizona, for "Semiconductor package with front side and back side redistribution structures and fabricating method thereof." . . .

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Semiconductor Package With Front Side and Back Side Redistribution Structures and Fabricating Method Thereof

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