Sunday - December 22, 2024

Lidded Microelectronic Device Packages and Related Systems, Apparatus, and Methods of Manufacture

2024-12-03

ALEXANDRIA, Virginia, Dec. 3 -- MICRON TECHNOLOGY, INC., Boise, Idaho has been assigned a patent (No. US 12159811 B2, initially filed May 27, 2022) developed by Xiaopeng Qu, Redmond, Washington, for "Lidded microelectronic device packages and related systems, apparatus, and methods of manufacture." . . .

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Lidded Microelectronic Device Packages and Related Systems, Apparatus, and Methods of Manufacture

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