Sunday - December 22, 2024

Dielectric-To-Metal Adhesion Promotion Material

2024-12-03

ALEXANDRIA, Virginia, Dec. 3 -- INTEL CORPORATION, Santa Clara, California has been assigned a patent (No. US 12159825 B2, initially filed March 10, 2021) developed by four inventors Rahul Manepalli, Chandler, Arizona; Suddhasattwa Nad, Chandler, Arizona; Marcel Wall, Phoenix, Arizona; and Darko Grujicic, Chandler, Arizona, for "Dielectric-to-metal adhesion promotion material." . . .

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Dielectric-To-Metal Adhesion Promotion Material

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