Sunday - December 22, 2024

Thermal Atomic Layer Deposition of Silicon-Containing Films

2024-12-03

ALEXANDRIA, Virginia, Dec. 3 -- LAM RESEARCH CORPORATION, Fremont, California has been assigned a patent (No. US 12157945 B2, initially filed July 24, 2020) developed by five inventors Awnish Gupta, Hillsboro, Oregon; Tengfei Miao, Beaverton, Oregon; Adrien Lavoie, Newberg, Oregon; Douglas Walter Agnew, Portland, Oregon; and Ian John Curtin, Portland, Oregon, for "Thermal atomic layer deposition of silicon-containing films." . . .

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Thermal Atomic Layer Deposition of Silicon-Containing Films

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