Monday - December 23, 2024

Bump Coplanarity for Semiconductor Device Assembly and Methods of Manufacturing the Same

2024-11-26

ALEXANDRIA, Virginia, Nov. 26 -- MICRON TECHNOLOGY, INC., Boise, Idaho has been assigned a patent (No. US 12154879 B2, initially filed Aug. 7, 2023) developed by Ko Han Lin, Taichung, Taiwan, and Tsung Che Tsai, Tainan, Taiwan, for "Bump coplanarity for semiconductor device assembly and methods of manufacturing the same." . . .

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Bump Coplanarity for Semiconductor Device Assembly and Methods of Manufacturing the Same

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